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Ceva Unveils Ceva-Waves Links200 – A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4

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Jan 02, 2025, 4:00 AM PST

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Turnkey integrated hardware and software platform IP combines fully featured Bluetooth dual mode with next generation High Data Throughput, alongside IEEE 802.15.4 for Thread/Zigbee/Matter, and includes Ceva’s state-of-the-art radio implemented on TSMC 12nm technology ROCKVILLE, Md., Jan….